Used as moisture and dielectric barriers, polymer parylene (p-xylylene/XY) coatings are conformal and pinhole free. Applied by a unique chemical vapor deposition (CVD) method, parylene penetrates beneath substrate facades, simultaneously attaching above surfaces at the molecular level. CVD generated films cover crevices, exposed internal regions, points and sharp edges uniformly, without gaps or breaches. Compared to liquid coating materials – acrylic, epoxy, silicone and urethane -- XY film layers are micron-thin, enhancing their utility for microelectricalmechanical systems (MEMS) and nano technology (NT).Read More
Parylene Coating Blog by Diamond-MT
After pertinent research you’ve determined parylene (XY) is the best conformal film for your coating assignment. Especially relevant were XY’s uniform protective and insulative properties, which are useful for numerous applications, ranging from printed-circuit boards (PCBs) to medical implants to military-grade purposes. Among parylene’s other advantages are:Read More
Conformal coatings differ in their material-specific performance properties as protective films for electronic assemblies. Knowing the operational characteristics of various coating-types and their functional association with assembly components supports successful film application. Issues that confound conformal coating selection and application result from potential post-application problems like:Read More
Conformal coatings frequently play a critical role in protecting medical, electronics, defense, aerospace, LED, and automotive applications from contaminants and other potentially hazardous substances. But they're not infallible.
Last week, we discussed what the causes of bubbles in conformal coating are. Now, let’s go through the various ways to remedy the bubbles.
NASA-STD 8739.1 is the Workmanship Standard for Polymeric Application on Electronic Assemblies, which describes NASA’s technical requirements, procedures, and documenting requirements for staking, conformal coating, bonding, and encapsulation of printed wiring boards and electronic assemblies. Included are requirements which establish the responsibility for documenting, fabrication, and inspection procedures to be used for NASA work including supplier innovations, special processes, and changes in technology. NASA-STD 8739.1 was initially released in August of 1999, with improvements and minor changes to the standard in recent years. The current up-to-date revision is NASA-STD 8739.1A with Change 2.