For various reasons, even people familiar with the variety of existing conformal coatings, their strengths, weaknesses and respective use often assume that the chemical vapor deposition (CVD) process used for parylene films incorporates a solvent, as an integral component of the procedure. This is false, for the reasons detailed below.
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The parylene variants are resistant to solvents and protect substrates solvents. This high level of security is maintained through temperatures of 150° C, seldom encountered in the actual use of PCBs or related electronics. These properties are largely a development of the unique molecular structure of parylene polymers, rendering them:
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While parylene provides a reliable, versatile conformal coating, it can require removal. When circumstances necessitate removal of liquid coatings – acrylic, epoxy, silicone or urethane – a wide range of chemical solvents can be used to detach the film from the underlying substrate. No single chemical material/process is equally successful for all uses, but solvent processes are employed most frequently because they do the least damage to printed circuit boards (PCBs) and their components. Such is not the case with parylene.
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Solvents can be used safely. However, the exposure of the operator to the solvent fumes must be REGULARLY measured and RECORDED. This ensures a safe operating environment and if an OSHA problem does arise in the future, evidence exists to rule out the conformal coating process as the culprit.
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