Parylene’s CVD method of application generates exceptionally lightweight yet durable conformal coatings, with superior barrier properties. Compared to liquid processes, the effects of gravity and surface tension are negligible, so there is no bridging, thin-out, pinholes, puddling, run-off or sagging.
Despite conformal coatings’ ability to dependably protect substrate surfaces of printed circuit boards (PCBs) and related electrical components, problems can sometimes occur which compel their removal. Chemical removal, which does the least damage to PCBs, is fine for wet coating substances like acrylic, epoxy, silicon and urethane. Chemical removal methods are far less successful for [&he
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In addition to cracking, a range of associated issues may interfere with successful coating of parylene films. Because it is applied via CVD, parylene generates a structurally continuous film covering a PCB or similar assembly. In CVD, the interaction of vapor-phase chemical reactants formulate a non-volatile solid film on a substrate, useful for a variety […]
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